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Accession Number
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N20120011811
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Title
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High-Density 3D TSOP Stack Packaging NEPP FY11 Summary Report.
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Publication Date
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Jan 2012
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Media Count
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16p
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Personal Author
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P. Zulueta
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Abstract
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This report documents a reliability evaluation of a particular implementation of package-on-package (PoP) highdensity
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Keywords
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Chips(Electronics)
Computer storage devices
Electronic packaging
Encapsulated microcircuits
Microelectronics
Reliability
Reliability analysis
Thermal cycling tests
Three dimensional bodies
Tomography
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Source Agency
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National Aeronautics and Space Administration
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NTIS Subject Category
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49 - Electrotechnology
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Corporate Author
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California Inst. of Tech., Pasadena. Jet Propulsion Lab.
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Document Type
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Technical report
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Title Note
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N/A
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NTIS Issue Number
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1301
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Contract Number
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NAS7-03001
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