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Accession Number N20120011811
Title High-Density 3D TSOP Stack Packaging NEPP FY11 Summary Report.
Publication Date Jan 2012
Media Count 16p
Personal Author P. Zulueta
Abstract This report documents a reliability evaluation of a particular implementation of package-on-package (PoP) highdensity
Keywords Chips(Electronics)
Computer storage devices
Electronic packaging
Encapsulated microcircuits
Microelectronics
Reliability
Reliability analysis
Thermal cycling tests
Three dimensional bodies
Tomography


 
Source Agency National Aeronautics and Space Administration
NTIS Subject Category 49 - Electrotechnology
Corporate Author California Inst. of Tech., Pasadena. Jet Propulsion Lab.
Document Type Technical report
Title Note N/A
NTIS Issue Number 1301
Contract Number NAS7-03001

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