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Accession Number DE96000395
Title Dymalloy: A composite substrate for high power density electronic components.
Publication Date Jun 1995
Media Count 9p
Personal Author J. A. Kerns N. J. Colella D. Makowiecki H. L. Davidson
Abstract High power density electronic components such as fast microprocessors and power semiconductors must operate below the maximum rated device junction temperature to ensure reliability. function temperatures are determined by the amount of heat generated and ...
Keywords Composite Materials
Copper Alloys
Silver Alloys
Thermal Conductivity
Thermal Expansion

Source Agency Technical Information Center Oak Ridge Tennessee
NTIS Subject Category 71F - Composite Materials
41K - Engineering Materials
49H - Semiconductor Devices
Corporate Author Lawrence Livermore National Lab., CA.
Document Type Conference proceedings
Title Note N/A
NTIS Issue Number 9607
Contract Number W-7405-ENG-48

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