Documents in the NTIS Technical Reports collection are the results of federally funded research. They are directly submitted to or collected by NTIS from Federal agencies for permanent accessibility to industry, academia and the public.  Before purchasing from NTIS, you may want to check for free access from (1) the issuing organization's website; (2) the U.S. Government Printing Office's Federal Digital System website http://www.gpo.gov/fdsys; (3) the federal government Internet portal USA.gov; or (4) a web search conducted using a commercial search engine such as http://www.google.com.
Accession Number DE96000395
Title Dymalloy: A composite substrate for high power density electronic components.
Publication Date Jun 1995
Media Count 9p
Personal Author J. A. Kerns N. J. Colella D. Makowiecki H. L. Davidson
Abstract High power density electronic components such as fast microprocessors and power semiconductors must operate below the maximum rated device junction temperature to ensure reliability. function temperatures are determined by the amount of heat generated and ...
Keywords Composite Materials
Copper Alloys
Diamonds
EDB/360104
EDB/360606
Meetings
Silver Alloys
Substrates
Thermal Conductivity
Thermal Expansion


 
Source Agency Technical Information Center Oak Ridge Tennessee
NTIS Subject Category 71F - Composite Materials
41K - Engineering Materials
49H - Semiconductor Devices
Corporate Author Lawrence Livermore National Lab., CA.
Document Type Conference proceedings
Title Note N/A
NTIS Issue Number 9607
Contract Number W-7405-ENG-48

Science and Technology Highlights

See a sampling of the latest scientific, technical and engineering information from NTIS in the NTIS Technical Reports Newsletter

Acrobat Reader Mobile    Acrobat Reader