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Accession Number DE2013-1074137
Title Heat Pipe Embedded AlSiC Plates for High Conductivity: Low CTE Heat Spreaders.
Publication Date 2010
Media Count 4p
Personal Author J. Weyant M. Johnson M. Occhionero S. Garner
Abstract Heat pipe embedded aluminum silicon carbide (AlSiC) plates are innovative heat spreaders that provide high thermal conductivity and low coefficient of thermal expansion (CTE). Since heat pipes are two phase devices, they demonstrate effective thermal conductivities ranging between 50,000 and 200,000 W/m-K, depending on the heat pipe length. Installing heat pipes into an AlSiC plate dramatically increases the plates effective thermal conductivity. AlSiC plates alone have a thermal conductivity of roughly 200 W/m-K and a CTE ranging from 7-12 ppm/ deg C, similar to that of silicon. An equivalent sized heat pipe embedded AlSiC plate has effective thermal conductivity ranging from 400 to 500 W/m-K and retains the CTE of AlSiC. Aluminum silicon carbide (AlSiC) is a metal matrix composite (MMC) well suited for electronics packaging.
Keywords Aluminum
Aluminum silicon carbide(AlSiC)
Coefficient of thermal expansion(CTE)
Electronics
Flat plates
Heat pipes
Heat spreaders
Metal matrix composites
Silicon carbides
Thermal conductivity
Vapors

 
Source Agency Technical Information Center Oak Ridge Tennessee
NTIS Subject Category 94 - Industrial & Mechanical Engineering
71F - Composite Materials
Corporate Author National Nuclear Security Administration, Kansas City, MO.
Document Type Technical report
Title Note N/A
NTIS Issue Number 1320
Contract Number DE-AC04-01AL66850

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