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Accession Number ADA563039
Title Foundation of a Heterogeneous Electronics Integration Platform.
Publication Date May 2012
Media Count 26p
Personal Author C. D. Meyer S. Bedair S. Trocchia T. Ivanov W. Benard
Abstract Due to increasing complexity, multi-material incompatibilities, and size constraints of electronics, no single monolithic technology can adequately realize the full spectrum of Army-relevant applications. The integration of a wide range of devices, each fabricated in different technologies and performing a well-defined task, would enable the construction of high performance systems. We use a custom microfabrication process flow to align dies within a silicon template wafer to obtain a common planar surface between them. The resulting silicon wafer with embedded chips would then be compatible with the U.S. Army Research Laboratory s (ARL) high quality factor (Q), state-of-the-art multilevel copper electroplating process. This approach permits high density interconnects and through silicon vias, reduces pad parasitics and allows researchers to construct highly miniaturized, modular heterogeneous platforms for Army systems. Future work will include testing and characterization of prototype heterogeneously integrated designs.
Keywords Army equipment
Army research
Chips(Electronics)
Electronics
Electroplating
Fabrication
High density
Integrated systems
Microminiaturization
Monolithic structures(Electronics)
Planar structures
Platforms
Prototypes
Wafers


 
Source Agency Non Paid ADAS
NTIS Subject Category 49 - Electrotechnology
Corporate Author Army Research Lab., Adelphi, MD. Sensors and Electron Devices Directorate.
Document Type Technical report
Title Note Final rept. Jun-Aug 2011.
NTIS Issue Number 1226
Contract Number N/A

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